Construction of an electrical model of a TQFP100 package with IC-EMC
نویسنده
چکیده
The following example compares the modelling results of a TQFP package given by the commercial tool Ansoft Maxwell Q3D and the tool Advanced Package Model provided by IC-EMC. Both software give models in terms of R, L, C lumped elements. An equivalent geometrical model is built under IC-EMC from basic mechanical data. Even if some differences exist between the geometrical models built with both software, simulation results are similar.
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